Unigichi develops high-heat-resistant polyamides based on biological resources

Unighi developed polyamide (PA) using raw materials from biological resources (biomass). The company claims that its various properties such as heat resistance, low water absorption, and chemical resistance have reached "the highest level in the world." Suitable for LED mirrors and surface mount connectors. Mass production is planned for the summer of 2012.

The newly-developed PA has a melting point of 310°C or more, has very high crystallinity, and is excellent in heat resistance. A 30% glass fiber-reinforced molded article was added to this PA, and its load deflection temperature (1.8 MPa) was said to exceed 300°C. In addition, the low water absorbability, chemical resistance, wear resistance, electrical properties, and the like are all equal to or higher than those of ordinary PAs. Plant ingredients account for more than 50%.

According to Unilki, current performance requirements for PA in the field of electrical electronics and automotive are getting higher and higher. Especially in the field of electrics and electronics, it is envisaged to be used in lead-free reflow soldering, and it is required to have heat resistance and low water absorption. Therefore, this time PA was developed. The product name is "XecoT".

Uniqek will introduce medium-volume production equipment in the future, and will begin mass production and sales in the summer of 2012. After 2015, the company plans to increase its production capacity to 5000t/year and formally launch its business. In addition, the company will present the results of this development at the "Japan Environmental Products Exhibition 2011" (December 15-17, 2011, Tokyo Ariake International Convention and Exhibition Center).