Introduction to multi-layer board

In 1961, Hazelting Corp. of the United States published Multiplanar, the pioneer of the first multi-layer board development. This multi-layer board method is almost the same as the current method of manufacturing multi-layer board by plated through hole method. After Japan entered this field in 1963, various ideas and manufacturing methods for multi-layer boards were gradually popularized around the world. As the era of computer-based integrated circuits has become more common, the application of computers has become more common. Due to the demand for high functionality, the large wiring capacity and good transmission characteristics have become the focus of multi-layer boards.